Analysis workflow WIP
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paper.tex
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paper.tex
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@ -133,6 +133,19 @@ Disassembly detection method
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Solderability
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\subsection{Analysis Workflow}
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Device Photo
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Device x-ray
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Device CT
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Disassembly
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Optical inspection
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Board x-ray
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Board CT
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Electrical tests
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Tampering tests
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Chemical tests
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\paragraph{Mesh monitoring}
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\section{Overview of Selected Samples}
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