Analysis workflow WIP

This commit is contained in:
jaseg 2025-04-17 18:21:37 +02:00
parent 53a2c451ce
commit 176d9ac4f8

View file

@ -133,6 +133,19 @@ Disassembly detection method
Solderability
\subsection{Analysis Workflow}
Device Photo
Device x-ray
Device CT
Disassembly
Optical inspection
Board x-ray
Board CT
Electrical tests
Tampering tests
Chemical tests
\paragraph{Mesh monitoring}
\section{Overview of Selected Samples}