Add harris presentation
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chapter-hsms/pres-harris.tex
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chapter-hsms/pres-harris.tex
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\documentclass[aspectratio=169]{beamer}
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\usetheme{default}
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\usepackage[T1]{fontenc}
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\usepackage{textcomp}
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\usepackage{graphicx}
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\usepackage{subcaption}
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\usepackage{siunitx}
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\usepackage{booktabs}
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\usepackage{array}
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\usepackage{ragged2e}
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\usepackage{colortbl}
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\usepackage{pdflscape}
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\usepackage[percent]{overpic}
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\graphicspath{{figures}}
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% Define custom commands if not already defined
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\newcommand{\surveypic}[2]{
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\begingroup
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\setlength{\fboxsep}{0.2mm}
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\begin{overpic}[percent,height=10mm]{#2}
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\put(100,85){\makebox[0pt][r]{\colorbox{white}{\footnotesize H#1}}}
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\end{overpic}
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\endgroup
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}
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\newcommand{\sampleno}[1]{#1}
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\title{Tamper-Sensing Meshes in the Wild}
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\author{Jan Sebastian Götte, TU Darmstadt}
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\date{2026-03-24}
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\begin{document}
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\begin{frame}
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\titlepage
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\end{frame}
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\begin{frame}{What is a Tamper Sensing Mesh?}
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\begin{itemize}
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\item Embedded looped conductor covering a surface
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\item Detects physical intrusion
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\begin{itemize}
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\item Drills, saws, lasers etc.
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\end{itemize}
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\item Triggers some tamper response
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\begin{itemize}
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\item Deleting keys
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\item Raising alarms
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\item Explosions?
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\end{itemize}
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\item Widely used in HSMs, payment terminals, ATMs, nuclear weapons
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\end{itemize}
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\end{frame}
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\begin{frame}{The History of Tamper-Sensing Meshes}
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\begin{itemize}
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\item \textbf{1870}: First patents using literal wire meshes to protect bank vaults
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\item \textbf{1902}: Multi-layer, orthogonal meshes documented
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\item \textbf{1971}: Printed circuit technology adopted
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\item \textbf{1990s}: Widespread commercial adoption with cryptographic applications
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\end{itemize}
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Other, hard to date examples: NSA use for protecting ciphering machines (earlier than 1973), US use in nuclear weapons
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\end{frame}
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\begin{frame}{Commercial Applications Today}
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\begin{itemize}
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\item Datacenter HSMs (Key management, payment processing)
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\item Card Payment Terminals (PIN encryption)
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\item ATM Encrypting Pin Pads (PIN encryption)
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\item Key Safes for Emergency services access (Germany only?)
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\item Mail Franking Machines (credit counter)
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\item Slot Machines (likely for DRM)
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\end{itemize}
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\end{frame}
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\begin{frame}{Our Survey}
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\textbf{Sample Size}: 30 devices
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\textbf{Device Types}:
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\begin{itemize}
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\item 23 Card payment terminals (Verifone, Ingenico, SumUp, etc.)
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\item 3 ATM Encrypting Pin Pads (NCR, Sagem)
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\item 2 HSM modules (SafeNet, Utimaco)
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\item 1 Franking machine
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\item 1 German slot machine CPU
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\end{itemize}
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\end{frame}
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\begin{frame}{Mesh Materials and Structure Sizes Observed}
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\begin{itemize}
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\item \textbf{Rigid PCB (FR-4):} Photolithographic etching, \SIrange{100}{200}{\micro\meter}
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\item \textbf{Polyimide/Copper FPC:} Photolithographic etching, \SIrange{100}{200}{\micro\meter}
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\item \textbf{Silver ink FPC:} Screen printing, \SIrange{500}{3000}{\micro\meter}
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\item \textbf{Carbon ink FPC:} Screen printing, \SIrange{500}{3000}{\micro\meter}
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\item \textbf{Gold laser direct structuring:} Laser Direct Structuring, \SIrange{50}{200}{\micro\meter}
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\item \textbf{IBM/Gore mesh:} Printed, \SIrange{200}{1500}{\micro\meter}
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\end{itemize}
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\end{frame}
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\begin{frame}{Survey Specimens - External Photos}
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\begin{figure}
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\centering
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\footnotesize
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\begin{tabular}[c]{cccccc}
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\surveypic{02}{survey_diag_S02.jpg}&
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\surveypic{03}{survey_diag_S03.jpg}&
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\surveypic{04}{survey_diag_S04.jpg}&
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\surveypic{05}{survey_diag_S05.jpg}&
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\surveypic{06}{survey_diag_S06.jpg}&
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\surveypic{08}{survey_diag_S08.jpg}\\
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\surveypic{09}{survey_diag_S09.jpg}&
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\surveypic{10}{survey_diag_S10.jpg}&
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\surveypic{11}{survey_diag_S11.jpg}&
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\surveypic{12}{survey_diag_S12.jpg}&
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\surveypic{13}{survey_diag_S13.jpg}&
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\surveypic{14}{survey_diag_S14.jpg}\\
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\surveypic{15}{survey_diag_S15.jpg}&
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\surveypic{16}{survey_diag_S16.jpg}&
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\surveypic{17}{survey_diag_S17.jpg}&
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\surveypic{18}{survey_diag_S18.jpg}&
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\surveypic{19}{survey_diag_S19.jpg}&
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\surveypic{20}{survey_diag_S20.jpg}\\
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\surveypic{21}{survey_diag_S21.jpg}&
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\surveypic{22}{survey_diag_S22.jpg}&
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\surveypic{23}{survey_diag_S23.jpg}&
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\surveypic{24}{survey_diag_S24.jpg}&
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\surveypic{25}{survey_diag_S25.jpg}&
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\surveypic{27}{survey_diag_S27.jpg}\\
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\surveypic{28}{survey_diag_S28.jpg}&
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\surveypic{29}{survey_diag_S29.jpg}&
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\surveypic{30}{survey_diag_S30.jpg}&
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\surveypic{31}{survey_diag_S31.jpg}&
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\surveypic{32}{survey_diag_S32.jpg}&
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\\
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\end{tabular}
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\end{figure}
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\end{frame}
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\begin{frame}{Survey Specimens - Internal Photos}
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\begin{figure}
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\centering
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\footnotesize
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\begin{tabular}[c]{cccccc}
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\surveypic{01}{survey_internal_09_S01.jpg}&
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\surveypic{02}{survey_internal_20_S02.jpg}&
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\surveypic{03}{survey_internal_11_S03.jpg}&
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\surveypic{04}{survey_internal_03_S04.jpg}&
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\surveypic{05}{survey_internal_10_S05.jpg}&
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\surveypic{06}{survey_internal_08_S06.jpg}\\
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\surveypic{08}{survey_internal_24_S08.jpg}&
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\surveypic{09}{survey_internal_13_S09.jpg}&
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\surveypic{10}{survey_internal_23_S10.jpg}&
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\surveypic{11}{survey_internal_17_S11.jpg}&
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\surveypic{12}{survey_internal_19_S12.jpg}&
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\surveypic{13}{survey_internal_02_S13.jpg}\\
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\surveypic{14}{survey_internal_00_S14.jpg}&
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\surveypic{15}{survey_internal_04_S15.jpg}&
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\surveypic{16}{survey_internal_05_S16.jpg}&
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\surveypic{17}{survey_internal_22_S17.jpg}&
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\surveypic{18}{survey_internal_21_S18.jpg}&
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\surveypic{19}{survey_internal_26_S19.jpg}\\
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\surveypic{20}{survey_internal_12_S20.jpg}&
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\surveypic{21}{survey_internal_15_S21.jpg}&
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\surveypic{22}{survey_internal_16_S22.jpg}&
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\surveypic{23}{survey_internal_07_S23.jpg}&
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\surveypic{24}{survey_internal_06_S24.jpg}&
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\surveypic{25}{survey_internal_25_S25.jpg}\\
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\surveypic{27}{survey_internal_18_S27.jpg}&
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\surveypic{28}{survey_internal_14_S28.jpg}&
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\surveypic{30}{survey_internal_29_S30.jpg}&
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\surveypic{31}{survey_internal_27_S31.jpg}&
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\surveypic{32}{survey_internal_28_S32.jpg}&
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\\
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\end{tabular}
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\end{figure}
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\end{frame}
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\begin{frame}{Mesh Trace Layouts}
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\begin{columns}[T]
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\begin{column}{0.5\textwidth}
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\centering
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\begin{overpic}[width=.45\textwidth]{hsm_mesh_offset.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
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\end{overpic}
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\hspace{1mm}
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\begin{overpic}[width=.45\textwidth]{hsm_mesh_orthogonal.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
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\end{overpic}
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\vspace{5mm}
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\begin{overpic}[width=.45\textwidth]{hsm_utimaco_mesh_gore.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
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\end{overpic}
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\hspace{1mm}
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\begin{overpic}[width=.45\textwidth]{hsm_mesh_stack_epp.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
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\end{overpic}
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\end{column}
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\begin{column}{0.45\textwidth}
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\raggedright
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\textbf{A:} Offset layers (H12)
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\textbf{B:} Orthogonal patterns (H14)
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\textbf{C:} Orthogonal + area pattern (H30)
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\textbf{D:} Spaced layers (H28)
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\end{column}
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\end{columns}
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\end{frame}
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\begin{frame}{Mesh Materials and Manufacturing}
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\centering
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\begin{tabular}{lll}
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\begin{overpic}[width=.22\textwidth]{trace_material_copper_pcb.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{trace_material_copper_flex.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{trace_material_silver.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
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\end{overpic}
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\\[3mm]
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\begin{overpic}[width=.22\textwidth]{trace_material_contact_gold_lds.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{trace_material_carbon.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
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\end{overpic}
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&
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\begin{tabular}[b]{@{}l@{}}
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\textbf{A:} Rigid PCB (H10) \\
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\textbf{B:} Flexible PCB (H15) \\
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\textbf{C:} Silver ink (H14) \\
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\textbf{D:} Laser Direct Structuring (H32) \\
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\textbf{E:} Carbon ink (H30)
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\end{tabular}
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\end{tabular}
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\end{frame}
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\begin{frame}{Mesh Connection Methods}
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\centering
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\begin{tabular}{ccc}
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\begin{overpic}[width=.20\textwidth]{connector_castellated_edge.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
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\end{overpic}
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&
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\begin{overpic}[width=.20\textwidth]{connector_elastomeric.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
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\end{overpic}
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&
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\begin{overpic}[width=.20\textwidth]{connector_rf_gasket.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
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\end{overpic}
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\\[2mm]
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\begin{overpic}[width=.20\textwidth]{connector_zif_fpc_2.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
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\end{overpic}
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&
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\begin{overpic}[width=.20\textwidth]{connector_stacking.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
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\end{overpic}
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&
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\begin{overpic}[width=.20\textwidth]{connector_metal_dome.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries F}}
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\end{overpic}
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\end{tabular}
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\vspace{3mm}
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\small
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\textbf{A:} Direct soldering (H05) \quad
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\textbf{B:} Elastomeric connector (H31) \quad
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\textbf{C:} EMI gasket (H14) \\
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\textbf{D:} FPC connector (H20) \quad
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\textbf{E:} Stacking connector (H17) \quad
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\textbf{F:} Tactile dome (H06)
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\end{frame}
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\begin{frame}{3D Mesh Construction Styles}
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\centering
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\begin{tabular}{lll}
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\begin{overpic}[width=.22\textwidth]{hsm_3d_style_fold_overlap.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{hsm_3d_style_fold_no_overlap.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{3d_construction_lds_top.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
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\end{overpic}
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\\[3mm]
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\begin{overpic}[width=.22\textwidth]{hsm_3d_style_vacform.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
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\end{overpic}
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&
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\begin{overpic}[width=.22\textwidth]{3d_construction_cards_standalone.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
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\end{overpic}
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&
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\begin{tabular}[b]{@{}l@{}}
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\textbf{A:} Folded with overlap (H03) \\
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\textbf{B:} Folded without overlap (H14) \\
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\textbf{C:} Laser Direct Structuring (H32) \\
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\textbf{D:} Thermoformed (H12) \\
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\textbf{E:} House-of-Cards (H08)
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\end{tabular}
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\end{tabular}
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\end{frame}
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\begin{frame}{Thermoforming Example}
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\begin{columns}[T]
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\begin{column}{0.32\textwidth}
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\centering
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\includegraphics[width=.6\textwidth]{survey_formed_mesh_before.jpg}\\
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\small Before removing lacquer
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\end{column}
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\begin{column}{0.32\textwidth}
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\centering
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\includegraphics[width=.6\textwidth]{survey_formed_mesh_after.jpg}\\
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\small After removing lacquer
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\end{column}
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\end{columns}
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\vspace{3mm}
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\small Formed cavities in printed foil mesh specimen H24
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\end{frame}
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\begin{frame}{Sandwich-Style Construction}
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\begin{columns}[T]
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\begin{column}{0.5\textwidth}
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\centering
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\begin{overpic}[width=.45\textwidth]{3d_construction_offset_mesh_delayered_contrast_improved.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
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\end{overpic}
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\hspace{1mm}
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\begin{overpic}[width=.45\textwidth]{3d_construction_via_stitch_mesh_delayer_2.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
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\end{overpic}
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\vspace{3mm}
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\begin{overpic}[width=.45\textwidth]{3d_construction_planar_stack.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
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\end{overpic}
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\hspace{1mm}
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\begin{overpic}[width=.45\textwidth]{3d_construction_cavity_2.jpg}
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\put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
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\end{overpic}
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\end{column}
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\begin{column}{0.45\textwidth}
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\raggedright
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\textbf{A:} Obstacle mesh coupons (H17)
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\textbf{B:} Via-fence meshes (H24)
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\textbf{C:} Planar sandwich stack (H24)
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\textbf{D:} PCB lid with cavity (H14)
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\end{column}
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\end{columns}
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\end{frame}
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\begin{frame}{Security Issues Observed}
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\textbf{Design Defects:}
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\begin{itemize}
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\item Meshes not overlapping at edges leaving gaps for probe insertion
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\item Gaps at mesh-PCB interfaces
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\item Thermoformed cavities with enlarged structure size at corners
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\end{itemize}
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\textbf{Obscurity Failures:}
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\begin{itemize}
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\item In one case, an opaque lacquer was easily removed with acetone (without damaging the mesh!)
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\item Trace patterns visible through cover layers due to surface unevenness
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\end{itemize}
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\end{frame}
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\begin{frame}{Design Recommendations (1/2)}
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\begin{itemize}
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\item Commodity PCB manufacturing process design rules in the \SIrange{100}{200}{\micro\meter} range are better than the state of the art in mesh structure size
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||||
\item Avoid ink printing processes or thermoforming because of their large structure size
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||||
\item Carefully think about your literal corner cases (and edges)!
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\begin{itemize}
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||||
\item Overlap meshes where possible.
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\end{itemize}
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||||
\item Use potting and cover layers, but verify that they work
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||||
\begin{itemize}
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||||
\item Check that you \emph{actually} can't see what's below
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||||
\item Test their chemical resistance (and that of your mesh)
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||||
\end{itemize}
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||||
\end{itemize}
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||||
\end{frame}
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||||
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\begin{frame}{Design Recommendations (2/2)}
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\begin{itemize}
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||||
\item Mixing tough potting or enclosure materials and fragile mesh materials makes life harder for an attacker
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||||
\begin{itemize}
|
||||
\item Consider using steel instead of plastic (also helps against X-ray inspection!)
|
||||
\item Use thin substrates and thin conductive layers for the mesh
|
||||
\item Balance adhesion so removing potting / cover layers tears away traces below
|
||||
\end{itemize}
|
||||
\item Overlap mesh layers at a 50\% structure size offset
|
||||
\item Space (some) mesh layers apart in Z direction to constrain attack tools
|
||||
\item Use a pressure-sensitive connection method like tactile domes or elastomeric conncetors
|
||||
\end{itemize}
|
||||
\end{frame}
|
||||
|
||||
\begin{frame}
|
||||
\centering
|
||||
\Huge Thank you!
|
||||
|
||||
\vspace{1cm}
|
||||
|
||||
\Large Questions?
|
||||
\end{frame}
|
||||
|
||||
\begin{frame}
|
||||
\centering
|
||||
Long-form version of this presentation in my thesis:
|
||||
|
||||
\url{https://jaseg.de/thesis-final-web.pdf}
|
||||
|
||||
\includegraphics{thesis_qr.png}
|
||||
\end{frame}
|
||||
|
||||
\begin{frame}{Specimen List (1/2)}
|
||||
\footnotesize
|
||||
\begin{tabular}{c>{\RaggedRight\arraybackslash}p{25mm}>{\RaggedRight\arraybackslash}p{35mm}ll}
|
||||
\toprule
|
||||
\textbf{ID} & \textbf{Device} & \textbf{Manufacturer} & \textbf{Type} & \textbf{Year} \\
|
||||
\midrule
|
||||
H01 & PED & Verifone & VX 570 & ca. 2010 \\
|
||||
H02 & Slot machine & Merkur / ADP & Sam 12 EC2 & ca. 2012 \\
|
||||
H03 & EPP & Sagem & USA1315-4240 & 2014 \\
|
||||
H04 & EPP & Sagem & USA1316-5120 & 2007 \\
|
||||
H05 & PED & Xac & xAPT-103 & 2014 \\
|
||||
H06 & PED & Ingenico & iCT250-11T1860A & 2016-17 \\
|
||||
H08 & PED & Sagem & NOR4100-4220 & 2012 \\
|
||||
H09 & PED & Hypercom & M4230 & 2010 \\
|
||||
H10 & PED & Worldline & YOMANI XR & 2016 \\
|
||||
H11 & PED & Banksys & C-ZAM Smash & 2004 \\
|
||||
H12 & PED & Hypercom & Optimum P2100 & 2010 \\
|
||||
H13 & PED & Ingenico & iCT 220-11T2938A & 2016 \\
|
||||
H14 & PED & Verifone & H5000 & 2016 \\
|
||||
H15 & PED & Verifone & MX 925 & 2018 \\
|
||||
H16 & PED & Verifone & V200c CTLS & 2021 \\
|
||||
H17 & PED & Verifone & VX 680 & 2014 \\
|
||||
\bottomrule
|
||||
\end{tabular}
|
||||
\end{frame}
|
||||
|
||||
\begin{frame}{Specimen List (2/2)}
|
||||
\footnotesize
|
||||
\begin{tabular}{c>{\RaggedRight\arraybackslash}p{25mm}>{\RaggedRight\arraybackslash}p{35mm}ll}
|
||||
\toprule
|
||||
\textbf{ID} & \textbf{Device} & \textbf{Manufacturer} & \textbf{Type} & \textbf{Year} \\
|
||||
\midrule
|
||||
H18 & PED & Ingenico & i7910 & 2010 \\
|
||||
H19 & PED & Banksys & XENTA & 2004-2011 \\
|
||||
H20 & PED & Verifone & VX 520 3G & 2017 \\
|
||||
H21 & PED & Verifone & V400m Plus 4G & 2018 \\
|
||||
H22 & PED & Ingenico & Move 3500 & 2020 \\
|
||||
H23 & PED & Ingenico & iPP 350-11T1718A & 2015 \\
|
||||
H24 & PED & Ingenico & iWL255-01T2117A & 2016 \\
|
||||
H25 & Franking Mach. & Neopost & IJ-25 & ca. 2001 \\
|
||||
H27 & PED & Sumup & AIR1E205 & 2021 \\
|
||||
H28 & EPP & NCR & 5814 UEPP & 2019 \\
|
||||
H29 & HSM & SafeNet & VBD-05 & 2018 \\
|
||||
H30 & HSM & Irdeto & Mayflower & 2011 \\
|
||||
H31 & PED & SumUp & SumUp 3G & 2019 \\
|
||||
H32 & PED & SumUp & SumUp Air & 2022 \\
|
||||
\bottomrule
|
||||
\end{tabular}
|
||||
\vspace{3mm}
|
||||
|
||||
\tiny PED: Pin Entry Device; EPP: Encrypting Pin Pad; HSM: Hardware Security Module
|
||||
\end{frame}
|
||||
|
||||
\end{document}
|
||||
Loading…
Add table
Add a link
Reference in a new issue