Update paper
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gerber
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gerber.zip
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.ipynb_checkpoints
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paper/paper.tex
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paper/paper.tex
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@ -54,51 +54,68 @@
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parts of the mesh. Our TDR circuit improves over previous low-cost TDR approaches by utilizing exclusively low-cost,
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consumer-grade components with a total Bill of Materials (BoM) cost of less than 10\$ while achieving a time
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resolution better than \qty{200}{\pico\second}.
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% We validate our mesh monitoring system in a number of realistic attack scenarios using a real-time, embeddable
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% Machine Learning (ML) classifier.
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% Should we validate our mesh monitoring system in a number of realistic attack scenarios using a real-time,
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% embeddable Machine Learning (ML) classifie?
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% TODO: Use Dynamic Time Warping to compare traces?
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\end{abstract}
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\todo{In abstract: specific bandwidth / risetime numbers.}
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\todo{In abstract: Add machine learning / "AI" classifier.}
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\section{Introduction}
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Security meshes continue to be the state of the art for tamper sensing in in applications where sophisticated physical
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attacks must be prevented. Security meshes usually consist of two or more conductive traces that are laid out in a
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meandering pattern to cover a surface, and which are monitored electrically to detect attempts at penetrating this
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surface. Security meshes can be implemented at the macro scale, covering entire Printed Circuit Board Assemblies
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surface. While commercial designs often only monitor for short circuits or breaks in the mesh traces, monitoring this
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coarse is incapable of detecting even less sophisticated attacks attempting to circumvent part of the mesh, thus
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requring the mesh to be made from a special material that is difficult to manipulate without breaking it.
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To enable the ues of less expensive, commodity materials such as Printed Circuit Boards (PCBs), the mesh's integrity
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must be monitored with higher fidelity. In this paper, we present a low-cost monitoring circuit for security meshes
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based on a Time-Domain Reflectometry (TDR) approach that provides such improved measurement fidelity compared to
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commercial systems, and enables the use of less sophisticated meshes made from less expensive materials.
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Compared to previous academic designs, our approach can be implemented at much lower cost since it exclusively uses
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inexpensive, commercially available mass-market components. Utilizing a proper TDR frontend, we improve over previous,
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delay-based approaches in monitoring fidelity, achieving sufficient sensitivity for the detection of high-impedance
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oscilloscope probes despite such probes being specifically designed to conduct measurements without disturbing the
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circuit under test. Unlike previous, capacitance-based approaches, our design is compatible with inexpensive signal
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switch ICs, enabling the protection of arbitrarily large meshes at minimal cost without compromising sensitivity.
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Security meshes can be implemented at the macro scale, covering entire Printed Circuit Board Assemblies
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(PCBAs) in applications such as Hardware Security Modules (HSMs) or card payment terminals, or they can be implemented
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at the micro scale to prevent the readout of secrets from Integrated Circuits (ICs) such as smartcards or Trusted
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Platform Modules (TPMs). Micro-scale tamper sensing meshes are usually as passive sensors without a continuous power
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supply, and are only checked once during system powerup, macro-scale meshes are usually implemented as active sensors
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with a continuous backup power supply so as to not give the attacker a window of attack when the remaining system is
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powered down.
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Platform Modules (TPMs). Commercial implementations of macro-scale security mesh monitoring circuits are largely limited
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to simple trace continuity monitoring due to cost constraints. A limited amount of academic work on higher-fidelity
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monitoring approaches exists, but comes with the use of expensive, specialty components and has not yet found practical
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adoption.
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There are some academic works suggesting the use of security meshes as Physically Uncloneable Functions (PUFs) to
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Micro-scale tamper sensing meshes are usually implemented as passive sensors without a continuous power supply, and are
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only checked once during system powerup, while macro-scale meshes are usually implemented as active sensors with a
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continuous backup power supply so as to not give the attacker a window of attack when the remaining system is powered
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down. There are some academic works suggesting the use of security meshes as Physically Uncloneable Functions (PUFs) to
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provide a high-fidelity tamper sensor that can even detect attempts at patching the mesh to fix traces broken in a
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drilling attack. While early work in this area was limited in the size of the protected envelope, recent advancements
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allow for the protection of entire PCBAs similar in size to common commercial systems such as HSMs or the processing
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subsystems of card payment terminals.
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subsystems of card payment terminals\todo{cite ihsm paper}.
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As is often the case with security technologies, in practice there exists a tension between the level of security
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offered by a particular security mesh implementation, and its implementation cost. The most secure meshes require
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specialized manufacturing techniques that aim to produce what is essentially a Flexible Printed Circuit (FPC) whose
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materials are specifically chosen to be as fragile as possible such that it breaks even during careful manipulation by
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an attacker.
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In contrast to this in the industry, simpler approaches are still commonly used for their ease of implementation. Often,
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As is often the case with security technologies, in practice a tension exists between the level of security offered by a
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particular security mesh implementation, and its implementation cost. The most secure meshes require specialized
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manufacturing techniques that aim to produce what is essentially a Flexible Printed Circuit (FPC) whose materials are
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specifically chosen to be as fragile as possible such that it breaks even during careful manipulation by an attacker. In
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contrast to this, industrially simpler approaches are still commonly used for their ease of implementation. Often,
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standard copper/polyimide FPCs are used because of the wide availability of manufacturing services. In some
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lower-security applications such as card payment terminals, meshes manufactured from simple PCBs are even used to
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provide protection in directions considered especially vulnerable, without enclosing the whole PCBA.
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lower-security applications such as card payment terminals, meshes manufactured from simple PCBs are used without
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enclosing the whole PCBA.
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In this paper, we introduce an approach for the design of security mesh monitoring circuitry that provides dramatically
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higher fidelity compared to state-of-the-art conductivity monitoring, improving the sensitivity of meshes even when
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higher fidelity compared to state-of-the-art conductivity monitoring and improves the sensitivity of meshes even when
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manufactured using less advanced technologies such as standard FPC or PCB processes. Our approach consists of an
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optimized, low-cost differential Time Domain Reflectometry (TDR) frontend that provides better than
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\qty{200}{\pico\second}( resolution, connected to a security mesh. Using our TDR frontend, mesh integrity can be
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characterized at high fidelity, producing several hundred measurements for each meter of mesh trace length.
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optimized, low-cost differential Time Domain Reflectometry (TDR) frontend built around a commodity microcontroller and
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an amplifier IC originally intended for digital video applications that together achieve pulse risetimes below
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\qty{200}{\pico\second}, corresponding to only \qty{3}{\centi\meter} of wave propagation inside the mesh at the speed of
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light in PCB material. Using our TDR frontend, mesh integrity can be characterized at high fidelity, producing 70 data
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points for each meter of mesh length, resulting in a measurement density per mesh area of
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\qty{150}{\bit\per\centi\meter^2} when using a mesh manufactured in a commercial PCB process.
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\todo{citations for applications}
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@ -203,8 +220,6 @@ article} to reconstruct a downsampled copy of the input signal in the analog dom
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\subsection{Low-Cost Time Domain Reflectometry}
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\subsection{Machine Learning and Anomaly Detection}
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\section{Time-Domain Reflectometry}
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An issue with a plain TDR measurement is that it only measures reflected signal components. If we connected a TDR
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@ -231,7 +246,9 @@ reflections out of it. Finally, we need a fast ADC to capture the reflections.
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The focus of our circuit design is on cost. Since physical attacks happen on a time scale of minutes or hours, we do not
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need a fast acquisition rate. Thus, we chose an equivalent-time sampling setup instead of direct conversion, reducing
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the requirements of our data acquisition and signal processing fronted from gigasamples per second to mere megasamples,
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well within the range what a commodity microcontroller can handle. A challenge in equivalent-time sampling is
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well within the range what a commodity microcontroller can handle.
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\todo{compare to that sram adc design}
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A challenge in equivalent-time sampling is
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precisely phase-synchronizing the sampling pulse to the fundamental frequency of the input signal, which is usually
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implemented by using a high-speed comparator. We can avoid this expensive component here since our TDR frontend
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generates the stimulus signal itself. Thus, we only have to generate a sampling pulse at an adjustable phase to the
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@ -413,8 +430,6 @@ layout, we leave its implementation to future work\todo{Mention this here, or be
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\subsection{Frontend Characterization}
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\section{Anomaly Detection through Machine Learning}
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\section{Experimental Evaluation}
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To validate our design, we will perform a two-fold evaluation. First, we want to measure the performance of our sampling
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@ -563,6 +578,18 @@ content such that it was still able to turn on the sampling gate's diode bridge
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&3
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&4\\\hline
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\textbf{Size}&
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$35\times\qty{70}{\milli\meter}$&
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$35\times\qty{70}{\milli\meter}$&
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$35\times\qty{70}{\milli\meter}$&
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$35\times\qty{70}{\milli\meter}$\\
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\textbf{Area}&
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$\qty{24.5}{\centi\meter^2}$&
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$\qty{24.5}{\centi\meter^2}$&
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$\qty{24.5}{\centi\meter^2}$&
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$\qty{24.5}{\centi\meter^2}$\\\hline
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\textbf{Trace width}&
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\qty{150}{\micro\meter}&
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\qty{200}{\micro\meter}&
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@ -662,7 +689,12 @@ content such that it was still able to turn on the sampling gate's diode bridge
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\begin{center}
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\includegraphics[width=\textwidth]{fig_mesh_length.pdf}
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\end{center}
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\caption{}
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\caption{TDR responses captured using our design with each of four candidate pulse amplifier ICs and four mesh test
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speciments. The four specimens cover the same area using four different densities, resulting in a length ratio of
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approximately $1:2:3:4$. The shown time range covers the primary reflection of the stimulus pulse's falling edge.
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The vertical scale of all four graphs is in Volts at the ADC. Note that due to different characteristics of the
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pulse amplifiers, the four circuit variants use different tuning of the post-sampling amplifier before the
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adc---thus the vertical scale should not be compared between ICs.}
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\label{fig_mesh_length}
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\end{figure}
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@ -672,7 +704,13 @@ content such that it was still able to turn on the sampling gate's diode bridge
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\begin{center}
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\includegraphics[width=\textwidth]{fig_manip_shape.pdf}
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\end{center}
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\caption{}
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\caption{TDR responses captured using our design under four different attack scenarios. In three scenarios, the
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mesh's traces are shorted in one of three locations. Location 1 is \qty{558}{\milli\meter}, location 2 is
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\qty{125}{\milli\meter} and location 3 is \qty{850}{\milli\meter} from the start of the mesh. In the fourth
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scenario, one mesh trace is cut midway through the mesh. The left and right plots show the positive and negative
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trace of the differential pair, respectively. The black traces show four baseline measurements with no manipulations
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taken in between attacks. The vertical offset between the baseline measurements is caused by temperature drift,
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which causes a small DC offset in our design. The vertical scale is in Volts at the ADC.}
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\label{fig_manip_shape}
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\end{figure}
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@ -680,7 +718,12 @@ content such that it was still able to turn on the sampling gate's diode bridge
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\begin{center}
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\includegraphics[width=\textwidth]{fig_probe_shape.pdf}
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\end{center}
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\caption{}
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\caption{The circuit's TDR response under a probing attack using an oscilloscope probe. Black traces are a series of
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un-probed baseline measurements taken between attacks. All traces are plotted relative to a separate baseline trace
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taken at the begginning of the experiment. The probe used was a Rigol PVP3150 $\times 1/\times 10$ probe used with
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ground clip grounded to the mesh ground and used without tip attachment. In each traces, the mesh was probed in one
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of three locations as in Figure\ \ref{fig_manip_shape}, and on one of the two mesh traces. The shown time range
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shows the primary reflection of the stimulus pulse's rising edge.}
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\label{fig_probe_shape}
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\end{figure}
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% spectrum analyzer-measured reconstructed rise times for PI3HDX12211 (new measuremewnts!) ONET8501 and TDP0604
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@ -1,6 +1,6 @@
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{
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"board": {
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"active_layer": 0,
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"active_layer": 2,
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"active_layer_preset": "",
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"auto_track_width": true,
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"hidden_netclasses": [],
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@ -17,14 +17,14 @@
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},
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"selection_filter": {
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"dimensions": false,
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"footprints": false,
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"footprints": true,
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"graphics": false,
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"keepouts": false,
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"lockedItems": false,
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"otherItems": false,
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"pads": true,
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"pads": false,
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"text": false,
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"tracks": true,
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"tracks": false,
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"vias": false,
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"zones": false
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},
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