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\subsection{Typical System Design and Threat Model}
A typical system design for a device like an HSM that employs TDR-based tamper sensing meshes would consist of a payload
PCB assembly enveloped from all directions in tamper sensing mesh PCBs. The payload PCB assembly would contain both the
TDR mesh monitoring circuit as well as payload circuitry such as the HSM's cryptographic coprocessor. The tamper-sensing
meshes we analyze in this paper have the mesh trace layer adjacent to a continuous ground plane to provide a clean,
constant impedance along the mesh trace. In a practical design, the mesh trace would be on the payload-facing side of
the mesh PCB(s), and the ground plane on the outside-facing side. This way, the ground plane simultaneously shields both
the mesh's traces and the payload circuitry from electromagnetic interference. At the same time, putting the mesh trace
on the inside makes it significantly harder to manipulate without disturbing its TDR response. In such a system, the
mesh monitoring circuit would be battery powered and would check for tamper attempts periodically even when the payload
is powered off, e.g.\ during shipping.
A typical system design for an HSM with TDR-based tamper sensing meshes would consist of a PCB assembly containing
payload components as well as the mesh monitoring circuit, and enclosed from all directions in rigid or flexible tamper
sensing mesh PCBs. In this paper we propose meshes that have a ground plane, which would be on the outer side of the
mesh PCBs and shield electromagnetic interference from outside. Mesh monitoring would be battery powered and would
periodically check for tamper attempts.
In this paper, we tested meshes made from inexpensive rigid FR-4 PCBs, multiple of which could be arranged around a
payload to protect it from all angles, or which could be used in an Inertial HSM as proposed by
% FIXME cite IHSM paper
Flexible Printed Circuits (FPCs) made with an industry-standard polyimide substrate could also be used, and would be
suitable for wrapping around a payload.
We consider an attacker motivated to extract the payload's secrets. Self-destruction by deleting secrets would suffice
as tamper response against this type of attacker. Such an attacker might want to probe parts of the payload circuit
using either conventional electrical contacts or using electromagnetic near-field probes that must be placed right on
top of the feature to be probed. An attacker might further attempt to manipulate the payload circuit, such as by
removing capacitors to enable a later power sidechannel attack. In preparation for an optical fault-injection attack, an
attacker might attempt decapsulating some of the payload circuit's ICs either using laser ablation or using chemical
etching. An attacker might also attempt fault injection attacks using either electrical contacts or electromagnetic
fault injection probes near a target feature.
We consider attackers that have access to industry-standard SMD rework equipment such as microscopes, microsoldering
irons, and fine tweezers. We also consider attackers that have access to more advanced equipment, such as laboratory
measurement equipment like high-bandwidth oscilloscopes and waveform generators. We consider attackers with standard
equipment for mechanical manipulation including precision milling machines and cutters. We do not consider bespoke
attack tools, or specialized tools for large-scale industrial manufacturing such as industrial drilling machines.
% FIXME TODO Minor revision system design and threat model
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