diff --git a/chapter-epa/chapter.tex b/chapter-epa/chapter.tex
index d489303..2965e9d 100644
--- a/chapter-epa/chapter.tex
+++ b/chapter-epa/chapter.tex
@@ -11,7 +11,7 @@
\todo{FIXME: Proper citation here}
\sourceattrib{This part is based on a short paper written by Jan Sebastian Götte and presented by Jan Sebastian Götte at
-the HS3 workshop at ESORICS 2025.}
+the HS3 workshop at ESORICS 2025~\cite{gotteGermanyRollingOut2026}.}
Looking at the landscape of computer security solutions, we are presented with a wide variety of vendors and products
that may give the impression that hardware security is a solved problem. Vendors sell various claims rangning from
\emph{``You don't need hardware security, just do it in the cloud!''}~\cite{
diff --git a/chapter-hsms/pres-harris.tex b/chapter-hsms/pres-harris.tex
new file mode 100644
index 0000000..c0daedc
--- /dev/null
+++ b/chapter-hsms/pres-harris.tex
@@ -0,0 +1,493 @@
+\documentclass[aspectratio=169]{beamer}
+\usetheme{default}
+\usepackage[T1]{fontenc}
+\usepackage{textcomp}
+\usepackage{graphicx}
+\usepackage{subcaption}
+\usepackage{siunitx}
+\usepackage{booktabs}
+\usepackage{array}
+\usepackage{ragged2e}
+\usepackage{colortbl}
+\usepackage{pdflscape}
+\usepackage[percent]{overpic}
+\usepackage[backend=biber,style=numeric,sorting=none]{biblatex}
+\addbibresource{../main.bib}
+
+\graphicspath{{figures}}
+
+% Define custom commands if not already defined
+\newcommand{\surveypic}[2]{
+ \begingroup
+ \setlength{\fboxsep}{0.2mm}
+ \begin{overpic}[percent,height=10mm]{#2}
+ \put(100,85){\makebox[0pt][r]{\colorbox{white}{\footnotesize H#1}}}
+ \end{overpic}
+ \endgroup
+ }
+\newcommand{\sampleno}[1]{#1}
+
+\title{Tamper-Sensing Meshes in the Wild}
+\author{\textbf{Jan Sebastian Götte} \& Björn Scheuermann\\TU Darmstadt\\contact: \texttt{research@jaseg.de}}
+\date{2026-03-24}
+
+\begin{document}
+
+\begin{frame}
+\titlepage
+\end{frame}
+
+\begin{frame}{What is a Tamper Sensing Mesh?}
+\begin{itemize}
+\item Embedded looped conductor covering a surface
+\item Detects physical intrusion
+ \begin{itemize}
+ \item Drills, saws, lasers etc.
+ \end{itemize}
+\item Triggers some tamper response
+ \begin{itemize}
+ \item Deleting keys
+ \item Raising alarms
+ \item Explosions?
+ \end{itemize}
+\item Widely used in HSMs, payment terminals, ATMs, nuclear weapons
+\end{itemize}
+\end{frame}
+
+\begin{frame}{The History of Tamper-Sensing Meshes}
+\begin{itemize}
+\item \textbf{1870}: First patents using literal wire meshes to protect bank vaults~\cite{ImprovementProtectingSafes1870,ImprovementElectromagneticEnvelopes1870}
+\item \textbf{1902}: Multi-layer, orthogonal meshes documented~\cite{suttonElectricallyprotectedStructure1902}
+\item \textbf{1971}: Printed circuit technology adopted~\cite{hamPrintedcircuitTypeSecurity1971}
+\item \textbf{1990s}: Widespread commercial adoption with cryptographic applications
+\end{itemize}
+
+Other, hard to date examples: NSA use for protecting ciphering machines~\cite{boakHistoryUSCommunications1973,boakHistoryUSCommunications1981}, US use in nuclear weapons~\cite{carterManagingNuclearOperations1987}
+\end{frame}
+
+\begin{frame}{Commercial Applications Today}
+\begin{itemize}
+\item Datacenter HSMs (Key management, payment processing)
+\item Card Payment Terminals (PIN encryption)
+\item ATM Encrypting Pin Pads (PIN encryption)
+\item Key Safes for Emergency services access (Germany only?)
+\item Mail Franking Machines (credit counter)
+\item Slot Machines (likely for DRM)
+\end{itemize}
+\end{frame}
+
+
+\begin{frame}{Our Survey}
+\textbf{Sample Size}: 30 devices
+
+\textbf{Device Types}:
+\begin{itemize}
+ \item 23 Card payment terminals (Verifone, Ingenico, SumUp, etc.)
+ \item 3 ATM Encrypting Pin Pads (NCR, Sagem)
+ \item 2 HSM modules (SafeNet, Utimaco)
+ \item 1 Franking machine
+ \item 1 German slot machine CPU
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Mesh Materials and Structure Sizes Observed}
+\begin{itemize}
+ \item \textbf{Rigid PCB (FR-4):} Photolithographic etching, \SIrange{100}{200}{\micro\meter}
+ \item \textbf{Polyimide/Copper FPC:} Photolithographic etching, \SIrange{100}{200}{\micro\meter}
+ \item \textbf{Silver ink FPC:} Screen printing, \SIrange{500}{3000}{\micro\meter}
+ \item \textbf{Carbon ink FPC:} Screen printing, \SIrange{500}{3000}{\micro\meter}
+ \item \textbf{Gold laser direct structuring:} Laser Direct Structuring, \SIrange{50}{200}{\micro\meter}
+ \item \textbf{IBM/Gore mesh:} Printed, \SIrange{200}{1500}{\micro\meter}
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Survey Specimens - External Photos}
+\begin{figure}
+ \centering
+ \footnotesize
+ \begin{tabular}[c]{cccccc}
+ \surveypic{02}{survey_diag_S02.jpg}&
+ \surveypic{03}{survey_diag_S03.jpg}&
+ \surveypic{04}{survey_diag_S04.jpg}&
+ \surveypic{05}{survey_diag_S05.jpg}&
+ \surveypic{06}{survey_diag_S06.jpg}&
+ \surveypic{08}{survey_diag_S08.jpg}\\
+ \surveypic{09}{survey_diag_S09.jpg}&
+ \surveypic{10}{survey_diag_S10.jpg}&
+ \surveypic{11}{survey_diag_S11.jpg}&
+ \surveypic{12}{survey_diag_S12.jpg}&
+ \surveypic{13}{survey_diag_S13.jpg}&
+ \surveypic{14}{survey_diag_S14.jpg}\\
+ \surveypic{15}{survey_diag_S15.jpg}&
+ \surveypic{16}{survey_diag_S16.jpg}&
+ \surveypic{17}{survey_diag_S17.jpg}&
+ \surveypic{18}{survey_diag_S18.jpg}&
+ \surveypic{19}{survey_diag_S19.jpg}&
+ \surveypic{20}{survey_diag_S20.jpg}\\
+ \surveypic{21}{survey_diag_S21.jpg}&
+ \surveypic{22}{survey_diag_S22.jpg}&
+ \surveypic{23}{survey_diag_S23.jpg}&
+ \surveypic{24}{survey_diag_S24.jpg}&
+ \surveypic{25}{survey_diag_S25.jpg}&
+ \surveypic{27}{survey_diag_S27.jpg}\\
+ \surveypic{28}{survey_diag_S28.jpg}&
+ \surveypic{29}{survey_diag_S29.jpg}&
+ \surveypic{30}{survey_diag_S30.jpg}&
+ \surveypic{31}{survey_diag_S31.jpg}&
+ \surveypic{32}{survey_diag_S32.jpg}&
+ \\
+ \end{tabular}
+\end{figure}
+\end{frame}
+
+\begin{frame}{Survey Specimens - Internal Photos}
+\begin{figure}
+ \centering
+ \footnotesize
+ \begin{tabular}[c]{cccccc}
+ \surveypic{01}{survey_internal_09_S01.jpg}&
+ \surveypic{02}{survey_internal_20_S02.jpg}&
+ \surveypic{03}{survey_internal_11_S03.jpg}&
+ \surveypic{04}{survey_internal_03_S04.jpg}&
+ \surveypic{05}{survey_internal_10_S05.jpg}&
+ \surveypic{06}{survey_internal_08_S06.jpg}\\
+ \surveypic{08}{survey_internal_24_S08.jpg}&
+ \surveypic{09}{survey_internal_13_S09.jpg}&
+ \surveypic{10}{survey_internal_23_S10.jpg}&
+ \surveypic{11}{survey_internal_17_S11.jpg}&
+ \surveypic{12}{survey_internal_19_S12.jpg}&
+ \surveypic{13}{survey_internal_02_S13.jpg}\\
+ \surveypic{14}{survey_internal_00_S14.jpg}&
+ \surveypic{15}{survey_internal_04_S15.jpg}&
+ \surveypic{16}{survey_internal_05_S16.jpg}&
+ \surveypic{17}{survey_internal_22_S17.jpg}&
+ \surveypic{18}{survey_internal_21_S18.jpg}&
+ \surveypic{19}{survey_internal_26_S19.jpg}\\
+ \surveypic{20}{survey_internal_12_S20.jpg}&
+ \surveypic{21}{survey_internal_15_S21.jpg}&
+ \surveypic{22}{survey_internal_16_S22.jpg}&
+ \surveypic{23}{survey_internal_07_S23.jpg}&
+ \surveypic{24}{survey_internal_06_S24.jpg}&
+ \surveypic{25}{survey_internal_25_S25.jpg}\\
+ \surveypic{27}{survey_internal_18_S27.jpg}&
+ \surveypic{28}{survey_internal_14_S28.jpg}&
+ \surveypic{30}{survey_internal_29_S30.jpg}&
+ \surveypic{31}{survey_internal_27_S31.jpg}&
+ \surveypic{32}{survey_internal_28_S32.jpg}&
+ \\
+ \end{tabular}
+\end{figure}
+\end{frame}
+
+\begin{frame}{Mesh Trace Layouts}
+\begin{columns}[T]
+\begin{column}{0.5\textwidth}
+ \centering
+ \begin{overpic}[width=.45\textwidth]{hsm_mesh_offset.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
+ \end{overpic}
+ \hspace{1mm}
+ \begin{overpic}[width=.45\textwidth]{hsm_mesh_orthogonal.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
+ \end{overpic}
+
+ \vspace{5mm}
+
+ \begin{overpic}[width=.45\textwidth]{hsm_utimaco_mesh_gore.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
+ \end{overpic}
+ \hspace{1mm}
+ \begin{overpic}[width=.45\textwidth]{hsm_mesh_stack_epp.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
+ \end{overpic}
+\end{column}
+\begin{column}{0.45\textwidth}
+ \raggedright
+ \textbf{A:} Offset layers (H12)
+
+ \textbf{B:} Orthogonal patterns (H14)
+
+ \textbf{C:} Orthogonal + area pattern (H30)
+
+ \textbf{D:} Spaced layers (H28)
+\end{column}
+\end{columns}
+\end{frame}
+
+\begin{frame}{Mesh Materials and Manufacturing}
+\centering
+\begin{tabular}{lll}
+ \begin{overpic}[width=.22\textwidth]{trace_material_copper_pcb.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{trace_material_copper_flex.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{trace_material_silver.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
+ \end{overpic}
+ \\[3mm]
+ \begin{overpic}[width=.22\textwidth]{trace_material_contact_gold_lds.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{trace_material_carbon.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
+ \end{overpic}
+ &
+ \begin{tabular}[b]{@{}l@{}}
+ \textbf{A:} Rigid PCB (H10) \\
+ \textbf{B:} Flexible PCB (H15) \\
+ \textbf{C:} Silver ink (H14) \\
+ \textbf{D:} Laser Direct Structuring (H32) \\
+ \textbf{E:} Carbon ink (H30)
+ \end{tabular}
+\end{tabular}
+\end{frame}
+
+\begin{frame}{Mesh Connection Methods}
+\centering
+\begin{tabular}{ccc}
+ \begin{overpic}[width=.20\textwidth]{connector_castellated_edge.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.20\textwidth]{connector_elastomeric.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.20\textwidth]{connector_rf_gasket.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
+ \end{overpic}
+ \\[2mm]
+ \begin{overpic}[width=.20\textwidth]{connector_zif_fpc_2.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.20\textwidth]{connector_stacking.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.20\textwidth]{connector_metal_dome.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries F}}
+ \end{overpic}
+\end{tabular}
+
+\vspace{3mm}
+
+\small
+\textbf{A:} Direct soldering (H05) \quad
+\textbf{B:} Elastomeric connector (H31) \quad
+\textbf{C:} EMI gasket (H14) \\
+\textbf{D:} FPC connector (H20) \quad
+\textbf{E:} Stacking connector (H17) \quad
+\textbf{F:} Tactile dome (H06)
+\end{frame}
+
+\begin{frame}{3D Mesh Construction Styles}
+\centering
+\begin{tabular}{lll}
+ \begin{overpic}[width=.22\textwidth]{hsm_3d_style_fold_overlap.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{hsm_3d_style_fold_no_overlap.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{3d_construction_lds_top.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
+ \end{overpic}
+ \\[3mm]
+ \begin{overpic}[width=.22\textwidth]{hsm_3d_style_vacform.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
+ \end{overpic}
+ &
+ \begin{overpic}[width=.22\textwidth]{3d_construction_cards_standalone.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries E}}
+ \end{overpic}
+ &
+ \begin{tabular}[b]{@{}l@{}}
+ \textbf{A:} Folded with overlap (H03) \\
+ \textbf{B:} Folded without overlap (H14) \\
+ \textbf{C:} Laser Direct Structuring (H32) \\
+ \textbf{D:} Thermoformed (H12) \\
+ \textbf{E:} House-of-Cards (H08)
+ \end{tabular}
+\end{tabular}
+\end{frame}
+
+\begin{frame}{Thermoforming Example}
+\begin{columns}[T]
+\begin{column}{0.48\textwidth}
+ \centering
+ \includegraphics[width=.6\textwidth]{survey_formed_mesh_before.jpg}\\
+ \small Before removing lacquer
+\end{column}
+\begin{column}{0.48\textwidth}
+ \centering
+ \includegraphics[width=.6\textwidth]{survey_formed_mesh_after.jpg}\\
+ \small After removing lacquer
+\end{column}
+\end{columns}
+\vspace{3mm}
+\centering
+\small Formed cavities in printed foil mesh specimen H24
+\end{frame}
+
+\begin{frame}{Sandwich-Style Construction}
+\begin{columns}[T]
+\begin{column}{0.5\textwidth}
+ \centering
+ \begin{overpic}[width=.45\textwidth]{3d_construction_offset_mesh_delayered_contrast_improved.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries A}}
+ \end{overpic}
+ \hspace{1mm}
+ \begin{overpic}[width=.45\textwidth]{3d_construction_via_stitch_mesh_delayer_2.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries B}}
+ \end{overpic}
+
+ \vspace{3mm}
+
+ \begin{overpic}[width=.45\textwidth]{3d_construction_planar_stack.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries C}}
+ \end{overpic}
+ \hspace{1mm}
+ \begin{overpic}[width=.45\textwidth]{3d_construction_cavity_2.jpg}
+ \put(5,92){\colorbox{white}{\footnotesize\bfseries D}}
+ \end{overpic}
+\end{column}
+\begin{column}{0.45\textwidth}
+ \raggedright
+ \textbf{A:} Obstacle mesh coupons (H17)
+
+ \textbf{B:} Via-fence meshes (H24)
+
+ \textbf{C:} Planar sandwich stack (H24)
+
+ \textbf{D:} PCB lid with cavity (H14)
+\end{column}
+\end{columns}
+\end{frame}
+
+\begin{frame}{Security Issues Observed}
+\begin{itemize}
+ \item Incomplete mesh coverage
+ \item Meshes not overlapping at edges leaving gaps for probe insertion
+ \item Gaps at mesh-PCB interfaces
+ \item Thermoformed cavities with enlarged structure size at corners
+ \item In one case, an opaque lacquer was easily removed with acetone (without damaging the mesh!)
+ \item Trace patterns visible through cover layers due to surface unevenness
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Design Recommendations (1/2)}
+ \begin{itemize}
+ \item Commodity PCB manufacturing process design rules in the \SIrange{100}{200}{\micro\meter} range are better than the state of the art in mesh structure size
+ \item Avoid ink printing processes or thermoforming because of their large structure size
+ \item Carefully think about your literal corner cases (and edges)!
+ \begin{itemize}
+ \item Overlap meshes where possible.
+ \end{itemize}
+ \item Use potting and cover layers, but verify that they work
+ \begin{itemize}
+ \item Check that you \emph{actually} can't see what's below
+ \item Test their chemical resistance (and that of your mesh)
+ \end{itemize}
+ \end{itemize}
+\end{frame}
+
+\begin{frame}{Design Recommendations (2/2)}
+ \begin{itemize}
+ \item Mixing tough potting or enclosure materials and fragile mesh materials makes life harder for an attacker
+ \begin{itemize}
+ \item Consider using steel instead of plastic (also helps against X-ray inspection!)
+ \item Use thin substrates and thin conductive layers for the mesh
+ \item Balance adhesion so removing potting / cover layers tears away traces below
+ \end{itemize}
+ \item Overlap mesh layers at a 50\% structure size offset
+ \item Space (some) mesh layers apart in Z direction to constrain attack tools
+ \item Use a pressure-sensitive connection method like tactile domes or elastomeric conncetors
+ \end{itemize}
+\end{frame}
+
+\begin{frame}
+\centering
+\Huge Thank you!
+
+\vspace{1cm}
+
+\Large Questions?
+
+\texttt{research@jaseg.de}
+\end{frame}
+
+\begin{frame}
+\centering
+Long-form version of this presentation in my thesis (pre-release, to be published this summer):
+
+\url{https://jaseg.de/thesis-final-web.pdf}
+
+\includegraphics{thesis_qr.png}
+\end{frame}
+
+\begin{frame}{Specimen List (1/2)}
+\footnotesize
+\begin{tabular}{c>{\RaggedRight\arraybackslash}p{25mm}>{\RaggedRight\arraybackslash}p{35mm}ll}
+\toprule
+\textbf{ID} & \textbf{Device} & \textbf{Manufacturer} & \textbf{Type} & \textbf{Year} \\
+\midrule
+H01 & PED & Verifone & VX 570 & ca. 2010 \\
+H02 & Slot machine & Merkur / ADP & Sam 12 EC2 & ca. 2012 \\
+H03 & EPP & Sagem & USA1315-4240 & 2014 \\
+H04 & EPP & Sagem & USA1316-5120 & 2007 \\
+H05 & PED & Xac & xAPT-103 & 2014 \\
+H06 & PED & Ingenico & iCT250-11T1860A & 2016-17 \\
+H08 & PED & Sagem & NOR4100-4220 & 2012 \\
+H09 & PED & Hypercom & M4230 & 2010 \\
+H10 & PED & Worldline & YOMANI XR & 2016 \\
+H11 & PED & Banksys & C-ZAM Smash & 2004 \\
+H12 & PED & Hypercom & Optimum P2100 & 2010 \\
+H13 & PED & Ingenico & iCT 220-11T2938A & 2016 \\
+H14 & PED & Verifone & H5000 & 2016 \\
+H15 & PED & Verifone & MX 925 & 2018 \\
+H16 & PED & Verifone & V200c CTLS & 2021 \\
+H17 & PED & Verifone & VX 680 & 2014 \\
+\bottomrule
+\end{tabular}
+\end{frame}
+
+\begin{frame}{Specimen List (2/2)}
+\footnotesize
+\begin{tabular}{c>{\RaggedRight\arraybackslash}p{25mm}>{\RaggedRight\arraybackslash}p{35mm}ll}
+\toprule
+\textbf{ID} & \textbf{Device} & \textbf{Manufacturer} & \textbf{Type} & \textbf{Year} \\
+\midrule
+H18 & PED & Ingenico & i7910 & 2010 \\
+H19 & PED & Banksys & XENTA & 2004-2011 \\
+H20 & PED & Verifone & VX 520 3G & 2017 \\
+H21 & PED & Verifone & V400m Plus 4G & 2018 \\
+H22 & PED & Ingenico & Move 3500 & 2020 \\
+H23 & PED & Ingenico & iPP 350-11T1718A & 2015 \\
+H24 & PED & Ingenico & iWL255-01T2117A & 2016 \\
+H25 & Franking Mach. & Neopost & IJ-25 & ca. 2001 \\
+H27 & PED & Sumup & AIR1E205 & 2021 \\
+H28 & EPP & NCR & 5814 UEPP & 2019 \\
+H29 & HSM & SafeNet & VBD-05 & 2018 \\
+H30 & HSM & Irdeto & Mayflower & 2011 \\
+H31 & PED & SumUp & SumUp 3G & 2019 \\
+H32 & PED & SumUp & SumUp Air & 2022 \\
+\bottomrule
+\end{tabular}
+\vspace{3mm}
+
+\tiny PED: Pin Entry Device; EPP: Encrypting Pin Pad; HSM: Hardware Security Module
+\end{frame}
+
+\begin{frame}[allowframebreaks]{References}
+\printbibliography[heading=none]
+\end{frame}
+
+\end{document}
diff --git a/defence/pearson-corr-1.png b/defence/pearson-corr-1.png
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diff --git a/defence/pearson-corr-sample-1.png b/defence/pearson-corr-sample-1.png
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diff --git a/defence/pearson-corr-sample.tex b/defence/pearson-corr-sample.tex
new file mode 100644
index 0000000..34de09d
--- /dev/null
+++ b/defence/pearson-corr-sample.tex
@@ -0,0 +1,21 @@
+\documentclass[convert={density=500}, border=2pt, varwidth=3in]{standalone}
+
+\usepackage{amsmath}
+\usepackage{amssymb}
+
+\begin{document}
+
+\begin{align*}
+r_{X, Y} &= \frac{
+\sum_{i=1}^n(x_i - \overline{x})(y_i - \overline{y})
+}{
+\sqrt{
+\sum_{i=1}^n(x_i-\overline{x})^2
+}
+\sqrt{
+\sum_{i=1}^n(y_i-\overline{y})^2
+}
+}
+\end{align*}
+
+\end{document}
diff --git a/defence/pearson-corr.tex b/defence/pearson-corr.tex
new file mode 100644
index 0000000..1ad3fc3
--- /dev/null
+++ b/defence/pearson-corr.tex
@@ -0,0 +1,12 @@
+\documentclass[convert={density=500}, border=2pt, varwidth=2in]{standalone}
+
+\usepackage{amsmath}
+\usepackage{amssymb}
+
+\begin{document}
+
+\begin{align*}
+\rho_{X,Y} &= \frac{\mathrm{cov}\left(X, Y\right)}{\sigma_X \sigma_Y}
+\end{align*}
+
+\end{document}
diff --git a/defence/phd defence pulse shaping.png b/defence/phd defence pulse shaping.png
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--- /dev/null
+++ b/defence/phd defence pulse shaping.svg
@@ -0,0 +1,957 @@
+
+
+
+
diff --git a/defence/phd defence slide drafts.svg b/defence/phd defence slide drafts.svg
new file mode 100644
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--- /dev/null
+++ b/defence/phd defence slide drafts.svg
@@ -0,0 +1,1508 @@
+
+
+
+