diff --git a/chapter-hsms/chapter.tex b/chapter-hsms/chapter.tex index 5b63f11..e63dcaf 100644 --- a/chapter-hsms/chapter.tex +++ b/chapter-hsms/chapter.tex @@ -314,9 +314,7 @@ heat from a heat gun as necessary to soften polymer compounds and to break glue \subsection{Results} -\subsubsection{Overall observations} - -\paragraph{Mesh materials.} +\subsubsection{Mesh materials.} We found meshes constructed from rigid PCBs as well as a number of Flexible Printed Circuit (FPC) processes. Tamper-sensing meshes constructed from PCBs sometimes used parts of an existing PCB, and sometimes additional PCBs only containing a mesh were added. Sometimes, multiple rigid PCB meshes were assembled in a house of cards fashion to enclose @@ -328,9 +326,157 @@ Overall, etched PCBs showed better resolution compared to silkscreen-printed mes flexible etched PCB meshes was generally in the order of \qtyrange{100}{200}{\micro\meter}, while feature size for printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. -\paragraph{Mesh layout.} +\subsubsection{Mesh layout.} -\paragraph{Contact construction.} +\begin{figure} + \centering + \begin{subfigure}[t]{0.45\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_mesh_offset.jpg} + \caption{Offset layers for more complete coverage} + \label{hsm_fig_mesh_layout_offset} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.45\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_mesh_orthogonal.jpg} + \caption{Orthogonal patterns on subsequent layers} + \label{hsm_fig_mesh_layout_orthogonal} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.45\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_utimaco_mesh_gore.jpg} + \caption{Combining orthogonal layers with area-covering pattern} + \label{hsm_fig_mesh_layout_utimaco} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.45\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_mesh_stack_epp.jpg} + \caption{Spacing mesh layers apart to constrict angular freedom of an attack tool} + \label{hsm_fig_mesh_layout_epp} + \end{subfigure} + \caption{Mesh trace layout approaches for multi-layer meshes.} + \label{hsm_fig_mesh_layout} +\end{figure} + +A key goal in tamper-sensing mesh design is to avoid any gaps in coverage. In single-layer meshes, gaps between adjacent +mesh traces cannot be avoided, and provide an easy approach for an attack. In multi-layer meshes, these structure +size-dependent gaps can be mitigated in multiple ways as shown in Figure~\ref{hsm_fig_mesh_layout}. + +\paragraph{Offset patterns.} In a two-sided foil mesh, most of the gaps between adjacent traces can be covered by simply +offsetting the pattern by one structure size in both axes between the foil's top and bottom layers as shown in +Figure~\ref{hsm_fig_mesh_layout_offset}. Depending on the mesh layout, only a small number of point-shaped gaps remain +at corners in mesh traces on one of the layers. The number of these gaps can be reduced by reducing the number of +misaligned corners between both layers for instance by choosing a systematic serpentine or spiral trace layout. + +\paragraph{Orthogonal patterns.} In some other specimens, the manufacturer chose the opposite approach of keeping the +mesh pattern mostly orthogonal on the mesh's two layers as shown in Figure~\ref{hsm_fig_mesh_layout_orthogonal}. While +this leads to a larger amount of gaps compared to offset patterns as described above, it also reduces the largest gap +size to about one structure size by one structure size. + +\paragraph{Combined approaches.} Figure~\ref{hsm_fig_mesh_layout_utimaco} shows the layout of a Gore tamper-sensing mesh +foil used in an Utimaco HSM. This mesh consists of two foil layers bonded to each other. The outer foil is patterned on +both sides with a sparse pattern of thin serpentine traces with the patterns on both layers being orthogonal to each +other. Both patterns are oriented at a \qty{45}{\degree} angle relative to the sides of the rectangular enclosed volume. +The inner foil is only patterned on one side, and contains a thicker serpentine trace laid out in a zigzag pattern. The +two foil layers are aligned such that no gaps remain between the layers. + +\paragraph{Using layer spacing.} Figure~\ref{hsm_fig_mesh_layout_epp} shows how an ATM Encrypting Pin Pad (EPP) +implemented the mesh on its keypad. Off-the-shelf metal snap dome contacts were used on the surface of a conventional +rigid PCB to create the keys. On top of the rigid PCB and contact domes, a two-layer copper/polyimide FPC with an +additional polyimide cover layer was glued down. Meshes were placed on both layers of the FPC, as well as on one +internal layer of the rigid PCB. The resulting structure had the FPC mesh layers separated from the rigid PCB mesh layer +by several hundred micrometers of the rigid PCB's substrate. The meshes on both the FPC and the rigid PCB used a +structure size of \qty{150}{\micro\meter}. The vertical separation between the two meshes was several times that +structure size, which limits the possible angles an attack tool could be inserted through both mesh layers. + +\subsubsection{3D construction.} + +\begin{figure} + \centering + \begin{subfigure}[t]{0.3\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_3d_style_fold_overlap.jpg} + \caption{Folded with overlap} + \label{hsm_fig_3d_struct_folded_overlap} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.3\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_3d_style_fold_no_overlap.jpg} + \caption{Folded without overlap} + \label{hsm_fig_3d_struct_folded_no_overlap} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.3\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_3d_style_vacform.jpg} + \caption{Thermoformed} + \label{hsm_fig_3d_struct_vacuum_form} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.3\textwidth} + \centering\includegraphics[width=\linewidth]{example-image-1x1.pdf} + \caption{House-of-Cards construction} + \label{hsm_fig_3d_struct_house_of_cards} + \end{subfigure} + \quad + \begin{subfigure}[t]{0.3\textwidth} + \centering\includegraphics[width=\linewidth]{hsm_3d_style_lds.jpg} + \caption{Laser Direct Structuring, Image from \cite{mahungORWLPCMost2016}} + \label{hsm_fig_3d_struct_lds} + \end{subfigure} + \caption[3D mesh construction styles]{Construction styles used to fit tamper sensing meshes into 3D envelopes.} + \label{hsm_fig_3d_struct} +\end{figure} + +In practice, meshes are almost always manufactured in planar processes first, and then transformed into a +three-dimensional shape. Figure~\ref{hsm_fig_3d_struct} +\subref{hsm_fig_3d_struct_folded_overlap}-\subref{hsm_fig_3d_struct_house_of_cards} show the construction styles we saw +among our samples that shape a planar mesh into a three-dimensional structure. +Figure~\ref{hsm_fig_3d_struct_folded_overlap} and Figure~\ref{hsm_fig_3d_struct_folded_no_overlap} have meshes produced +as flexible printed circuits, in Figure~\ref{hsm_fig_3d_struct_folded_overlap} using a standard photolithographic +copper/polyimide FPC process usually used for flexible PCBs, and in Figure~\ref{hsm_fig_3d_struct_folded_overlap} using +a standard silver ink screenprinting process. The choice in Figure~\ref{hsm_fig_3d_struct_folded_no_overlap} not to +overlap the mesh in the corner is likely caused by manufacturing considerations, since it might be difficult to ensure +proper folding of a small foil tab with adhesive pre-applied. + +Figure~\ref{hsm_fig_3d_struct_vacuum_form} shows a sample of a flexible circuit manufactured in a screenprinted +silver-ink process thermoformed into a three-dimensional shape. The flexible circuit mesh is first produced in a +standard planar printing process. After printing and curing, the resulting foil is then heated to soften it, and forced +into a three-dimensional shape using a mold. Depending on the process, one or two molds, and vacuum or pressured air can +be used to shape the foil. The process requires a screenprinted flexible circuit, and would not work with +copper/polyimide flexible PCBs since their copper layer is too thick to plastically deform without tearing, and because +polyimide is not sufficiently thermoplastic at low temperatures. + +Thermoforming is a cheap industry standard process, but applied to flexible circuits it has some limitations. First, +only 2.5-dimensional structures can be created since the starting product is always a planar sheet. Second, the sheet +cannot be cut or contain slots or large holes before forming since it needs to be kept under a constant tension from all +sides to ensure it evenly stretches into the mold. Finally, the depth achievable in such a process is rather limited, +with no sample in our survey exceeding \qty{2}{\milli\meter}\todo{Get proper number}. Higher depths would require +extensive deformation of the mesh circuit's plastic substrate, which could lead to tears in the mesh traces since the +particle-based conductive inks used for screen-printed electronics are inelastic. + +The specimen in Figure~\ref{hsm_fig_3d_struct_vacuum_form} shows one further design defect. The mesh shown does not +extend to the edges of the plastic cover it has been molded into. When this cover is placed on top of a PCB to protect +components on the PCB from tampering, this leaves a large gap between the bottom edge of the mesh and the PCB surface, +through which probes can be inserted to access either the payload circuit or the mesh monitoring circuitry. +\todoplaceholder{take pic of sample H08 card slot cover} + +Figure~\ref{house of cards pcb construction} shows a card slot being protected by several rigid PCBs assembled into a +three-dimensional structure. Solder connections between large pads are used to mechanically and electrically join the +boards. While the rigid PCBs used in such as structure can be produced in a highly inexpensive, standard process, this +style of construction requires manual assembly leading to increased labor cost. Furthermore, the construction leaves +large gaps at edges and corners, which is not a problem for card slot protection in payment applications but which would +be a flaw in a more standard HSM application. + +Figure~\ref{hsm_fig_3d_struct_lds} shows the resutl of Laser Direct Structuring (LDS), a process that avoids some of the +limitations of thermoformed planar meshes. In LDS, a plastic part is covered in a conductive pattern in a combination of +selective laser erosion of its surface and a series of preparation and electroless metal plating steps. LDS allows +covering complex three-dimensional shapes, with the main limitation being that all patterned areas must have a direct +line of sight to the outside for the scanning laser to reach it. Thus, the outside of complex parts can be covered, but +internal cavities cannot. LDS is commonly used to create complex antenna shapes on the surface of internal structural +plastic parts for smartphones, but is more costly compared to screenprinting processes due to its complexity. A further +disadvantage of LDS is that it is only suitable for single-layer patterns, while two layers are easily achievable in +silkscreen and photolithographic PCB processes by patterning both sides of the substrate. More layers can be achived in +these processes by simply stacking multiple foil layers and adding vias (through contacts), or by folding. + +\subsubsection{Contact construction.} \subsubsection{Payment Terminal Construction} @@ -338,18 +484,18 @@ printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. \centering \includegraphics[width=0.7\textwidth]{mesh_fold_screenshot.pdf} \caption[HSM appliance CT scan]{Computed Tomography (CT) scan of a corner of the PCIe HSM module from an Utimaco - rackmount HSM appliance. Visible are several capacitors, the edge of a large IC, and a large Flat Flexible Cable - (FFC) connector. Two layers of metal enclosures with resin potting in between are visible, and the security mesh can - be seen folded between layers of the folded FFC cable connecting to the outside.} + rackmount HSM appliance. Visible are several capacitors, the edge of a large IC, and a large Flat Flexible Cable + (FFC) connector. Two layers of metal enclosures with resin potting in between are visible, and the security mesh + can be seen folded between layers of the folded FFC cable connecting to the outside.} \label{hsm_fig_utimaco_ct} \end{figure} \begin{figure} \centering \includegraphics[width=\textwidth]{cut_chip_scene.pdf} - \caption[Ingenico Payment Terminal HSM CT Section Cut]{CT Section cut across the Ingenico potted module sample. The fold pattern of the mesh foil can be seen - clearly. The mesh traces can be seen on both sides of the foil. The two-layer PCB and the lead frame and bond wires - of a chip soldered on its top side are visible.} + \caption[Ingenico Payment Terminal HSM CT Section Cut]{CT Section cut across the Ingenico potted module sample. The + fold pattern of the mesh foil can be seen clearly. The mesh traces can be seen on both sides of the foil. The + two-layer PCB and the lead frame and bond wires of a chip soldered on its top side are visible.} \label{fig_ingenico_cut} \end{figure} @@ -357,8 +503,8 @@ printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. \centering \includegraphics[width=\textwidth]{mesh_pitch.pdf} \caption[Ingenico Payment Terminal HSM Mesh Pitch]{A horizontal cut through the Ingenico potted module with - millimeter scale next to the mesh foil. As is visible, the mesh has a trace pitch of \qty{1.0}{\milli\meter} and - traces are offset between the two mesh layers to reduce the amount of gaps between traces.} + millimeter scale next to the mesh foil. As is visible, the mesh has a trace pitch of \qty{1.0}{\milli\meter} and + traces are offset between the two mesh layers to reduce the amount of gaps between traces.} \label{fig_ingenico_pitch} \end{figure} @@ -366,9 +512,9 @@ printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. \centering \includegraphics[width=\textwidth]{mesh_contact_joint.pdf} \caption[Ingenico Payment Terminal HSM Mesh Contacts]{Mesh contact joints in the Ingenico potted module sample. The - mesh is a foil that is attached to the PCB through bent stamped metal contacts. The contacts are riveted into large - contact pads patterend onto the mesh foil, and are soldered to the PCB. Next to the contacts, the mesh layout is - visble clearly.} + mesh is a foil that is attached to the PCB through bent stamped metal contacts. The contacts are riveted into + large contact pads patterend onto the mesh foil, and are soldered to the PCB. Next to the contacts, the mesh + layout is visble clearly.} \label{fig_ingenico_contacts} \end{figure} @@ -376,7 +522,7 @@ printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. \centering \includegraphics[width=\textwidth]{open_end_detail.pdf} \caption[Ingenico Payment Terminal HSM End Closure]{Connector end of the Ingenico potted module sample. This cut - shows that the mesh only encloses the PCB on three sides, and the connector side is left unprotected.} + shows that the mesh only encloses the PCB on three sides, and the connector side is left unprotected.} \label{fig_ingenico_end} \end{figure} @@ -384,10 +530,10 @@ printed foil meshes was coarser at between \qtyrange{500}{3000}{\micro\meter}. \centering \includegraphics[width=\textwidth]{mesh_geom.pdf} \caption[Ingenico Payment Terminal HSM Mesh 3D]{3D reconstruction of the mesh from the Ingenico potted module - sample. The mesh layout can clearly be seen. From this 3D view, the mesh construction is evident: A T-shaped mesh - foil is wrapped around the PCB on three sides, with PCB tabs at two corners acting as locating and fixturing - features. In the corners, cylindrical components are visible that likely serve as an attempt at sensing intrusion - through the corners.} + sample. The mesh layout can clearly be seen. From this 3D view, the mesh construction is evident: A T-shaped + mesh foil is wrapped around the PCB on three sides, with PCB tabs at two corners acting as locating and + fixturing features. In the corners, cylindrical components are visible that likely serve as an attempt at + sensing intrusion through the corners.} \label{fig_ingenico_3d} \end{figure} diff --git a/chapter-hsms/figures/hsm_3d_style_fold_no_overlap.jpg b/chapter-hsms/figures/hsm_3d_style_fold_no_overlap.jpg new file mode 100644 index 0000000..ce92464 Binary files /dev/null and b/chapter-hsms/figures/hsm_3d_style_fold_no_overlap.jpg differ diff --git a/chapter-hsms/figures/hsm_3d_style_fold_overlap.jpg b/chapter-hsms/figures/hsm_3d_style_fold_overlap.jpg new file mode 100644 index 0000000..dca6a4f Binary files /dev/null and b/chapter-hsms/figures/hsm_3d_style_fold_overlap.jpg differ diff --git a/chapter-hsms/figures/hsm_3d_style_lds.jpg b/chapter-hsms/figures/hsm_3d_style_lds.jpg new file mode 100644 index 0000000..d2540a7 Binary files /dev/null and b/chapter-hsms/figures/hsm_3d_style_lds.jpg differ diff --git a/chapter-hsms/figures/hsm_3d_style_lds_raw.jpg b/chapter-hsms/figures/hsm_3d_style_lds_raw.jpg new file mode 100644 index 0000000..195a5c6 Binary files /dev/null and b/chapter-hsms/figures/hsm_3d_style_lds_raw.jpg differ diff --git a/chapter-hsms/figures/hsm_3d_style_vacform.jpg b/chapter-hsms/figures/hsm_3d_style_vacform.jpg new file mode 100644 index 0000000..db0d07c Binary files /dev/null and b/chapter-hsms/figures/hsm_3d_style_vacform.jpg differ diff --git a/chapter-hsms/figures/hsm_mesh_offset.jpg b/chapter-hsms/figures/hsm_mesh_offset.jpg new file mode 100644 index 0000000..01e2330 Binary files /dev/null and b/chapter-hsms/figures/hsm_mesh_offset.jpg differ diff --git a/chapter-hsms/figures/hsm_mesh_orthogonal.jpg b/chapter-hsms/figures/hsm_mesh_orthogonal.jpg new file mode 100644 index 0000000..2e9ac12 Binary files /dev/null and b/chapter-hsms/figures/hsm_mesh_orthogonal.jpg differ diff --git a/chapter-hsms/figures/hsm_mesh_stack_epp.jpg b/chapter-hsms/figures/hsm_mesh_stack_epp.jpg new file mode 100644 index 0000000..138f498 Binary files /dev/null and b/chapter-hsms/figures/hsm_mesh_stack_epp.jpg differ diff --git a/chapter-hsms/figures/hsm_utimaco_mesh_gore.jpg b/chapter-hsms/figures/hsm_utimaco_mesh_gore.jpg new file mode 100644 index 0000000..bf1d8b1 Binary files /dev/null and b/chapter-hsms/figures/hsm_utimaco_mesh_gore.jpg differ diff --git a/chapter-introduction/chapter.tex b/chapter-introduction/chapter.tex index 7a96bde..6c9d0cb 100644 --- a/chapter-introduction/chapter.tex +++ b/chapter-introduction/chapter.tex @@ -5,6 +5,8 @@ necessity is now obvious to everyone. } +%FIXME work in rogawayMoralCharacterCryptographic? + \chaptertitle{Introduction} All Cops Are Bastards, or ACAB is a slogan popular in far left and anarchist circles since the mid-twentieth century diff --git a/main.bib b/main.bib index 7a4ba68..2dc1fff 100644 --- a/main.bib +++ b/main.bib @@ -1770,6 +1770,18 @@ urldate = {2021-04-01} } +@online{ednAchieveTamperproofCapacitive2015, + title = {Achieve Tamper-Proof Capacitive Sensing}, + author = {EDN}, + date = {2015-01-12T14:24:00+00:00}, + url = {https://www.edn.com/achieve-tamper-proof-capacitive-sensing/}, + urldate = {2025-09-03}, + abstract = {Applications such as Point Of Sale (POS) devices and keypads for secure door locks are required to be tamper resistant. If these devices are tampered}, + langid = {american}, + organization = {EDN}, + file = {/home/jaseg/Zotero/storage/47BLRUGY/achieve-tamper-proof-capacitive-sensing.html} +} + @incollection{eppenAnforderungenEinzelteileRundfunkempfanger1927, title = {Anforderungen an Die {{Einzelteile}} Der {{Rundfunkempfänger}}; {{Gesichtspunkte}} Für Den {{Bau}} Der {{Geräte}}}, booktitle = {Die Wissenschaftlichen {{Grundlagen}} Des {{Rundfunkempfangs}}}, @@ -2317,6 +2329,16 @@ file = {/home/jaseg/Zotero/storage/XRXV6BY6/Grobkonzept ePA für alle.pdf} } +@online{groupUsingLaserDirect2012, + title = {Using {{Laser Direct Structuring}} ({{LDS}}) to {{Create Robust Hardware Security Devices}}}, + author = {Group, SAE Media}, + date = {2012-10-01}, + url = {https://www.mobilityengineeringtech.com/component/content/article/14919-using-laser-direct-structuring-lds-to-create-robust-hardware-security-devices}, + urldate = {2025-09-03}, + abstract = {A wide range of devices are designed to handle, convey and store sensitive information that requires varying degrees of security from protecting low level administrative to classified and top secret information.}, + langid = {english} +} + @article{grunenfelderFastSinglephotonDetectors2023, title = {Fast Single-Photon Detectors and Real-Time Key Distillation Enable High Secret-Key-Rate Quantum Key Distribution Systems}, author = {Grünenfelder, Fadri and Boaron, Alberto and Resta, Giovanni V. and Perrenoud, Matthieu and Rusca, Davide and Barreiro, Claudio and Houlmann, Raphaël and Sax, Rebecka and Stasi, Lorenzo and El-Khoury, Sylvain and Hänggi, Esther and Bosshard, Nico and Bussières, Félix and Zbinden, Hugo}, @@ -2601,6 +2623,15 @@ keywords = {fatigue,optical fibres,tensile strength} } +@misc{henkelelectronicmaterialsLoctitePrintedElectronics2019, + title = {Loctite {{Printed Electronics}}: {{Inks}} and {{Coatings}}}, + author = {{Henkel Electronic Materials}}, + date = {2019-02-14}, + url = {https://print-your-electronics-with-loctite.com/mediafiles/Bilder/Brochure_Henkel_Inks_and_Coatings.pdf}, + urldate = {2025-09-03}, + file = {/home/jaseg/Zotero/storage/RUKG95IR/Brochure_Henkel_Inks_and_Coatings.pdf} +} + @article{henzingerOneServerPrice, title = {One {{Server}} for the {{Price}} of {{Two}}: {{Simple}} and {{Fast Single-Server Private Information Retrieval}}}, author = {Henzinger, Alexandra and Hong, Matthew M and Corrigan-Gibbs, Henry and Meiklejohn, Sarah and Vaikuntanathan, Vinod}, @@ -3302,6 +3333,14 @@ file = {/home/jaseg/Zotero/storage/P8B7NSNB/Koehler-Sidki et al. - 2017 - Setting best practice criteria for self-differenci.pdf} } +@article{koemmerlingDesignPrinciplesTamperResistant, + title = {Design {{Principles}} for {{Tamper-Resistant Smartcard Processors}}}, + author = {Koemmerling, Oliver and Kuhn, Markus G}, + abstract = {We describe techniques for extracting protected software and data from smartcard processors. This includes manual microprobing, laser cutting, focused ion-beam manipulation, glitch attacks, and power analysis. Many of these methods have already been used to compromise widely-fielded conditionalaccess systems, and current smartcards offer little protection against them. We give examples of lowcost protection concepts that make such attacks considerably more difficult.}, + langid = {english}, + file = {/home/jaseg/Zotero/storage/2AIT93LW/Koemmerling and Kuhn - Design Principles for Tamper-Resistant Smartcard P.pdf} +} + @article{kohlsVerLocVerifiableLocalization, title = {{{VerLoc}}: {{Verifiable Localization}} in {{Decentralized Systems}}}, author = {Kohls, Katharina and Diaz, Claudia}, @@ -3961,6 +4000,19 @@ langid = {english} } +@online{mahungORWLPCMost2016, + title = {{{ORWL PC}}: {{The}} Most Secure Home Computer Ever}, + shorttitle = {{{ORWL PC}}}, + author = {Mah Ung, Gordon}, + date = {2016-09-14}, + url = {https://www.pcworld.com/article/416372/orwl-pc-the-most-secure-home-computer-ever.html}, + urldate = {2025-09-03}, + abstract = {ORWL's secure PC is hardened against physical attacks, using technology you might find in a bank's ATM.}, + langid = {english}, + organization = {PCWorld}, + file = {/home/jaseg/Zotero/storage/9CKQB34P/orwl-pc-the-most-secure-home-computer-ever.html} +} + @article{maierContributionSystemDesign2019, title = {Contribution to the {{System Design}} of {{Contactless Energy Transfer Systems}}}, author = {Maier, David and Heinrich, Jörg and Zimmer, Marco and Maier, Marcel and Parspour, Nejila}, @@ -5366,6 +5418,14 @@ file = {/home/jaseg/Zotero/storage/B8JEIE23/Roetteler et al. - 2017 - Quantum Resource Estimates for Computing Elliptic .pdf} } +@article{rogawayMoralCharacterCryptographic, + title = {The {{Moral Character}} of {{Cryptographic Work}}}, + author = {Rogaway, Phillip}, + abstract = {Cryptography rearranges power: it configures who can do what, from what. This makes cryptography an inherently political tool, and it confers on the field an intrinsically moral dimension. The Snowden revelations motivate a reassessment of the political and moral positioning of cryptography. They lead one to ask if our inability to effectively address mass surveillance constitutes a failure of our field. I believe that it does. I call for a community-wide effort to develop more effective means to resist mass surveillance. I plead for a reinvention of our disciplinary culture to attend not only to puzzles and math, but, also, to the societal implications of our work.}, + langid = {english}, + file = {/home/jaseg/Zotero/storage/MPMSITSP/Rogaway - The Moral Character of Cryptographic Work.pdf} +} + @article{rosaCalculationSelfinductanceSinglelayer1906, title = {Calculation of the Self-Inductance of Single-Layer Coils}, author = {Rosa, E. B.},