diff --git a/chapter-hsms/chapter.tex b/chapter-hsms/chapter.tex
index e63dcaf..f52af28 100644
--- a/chapter-hsms/chapter.tex
+++ b/chapter-hsms/chapter.tex
@@ -411,7 +411,7 @@ structure size, which limits the possible angles an attack tool could be inserte
     \end{subfigure}
     \quad
     \begin{subfigure}[t]{0.3\textwidth}
-        \centering\includegraphics[width=\linewidth]{example-image-1x1.pdf}
+        \centering\includegraphics[width=\linewidth]{3d_construction_cards.jpg}
         \caption{House-of-Cards construction}
         \label{hsm_fig_3d_struct_house_of_cards}
     \end{subfigure}
@@ -476,7 +476,72 @@ disadvantage of LDS is that it is only suitable for single-layer patterns, while
 silkscreen and photolithographic PCB processes by patterning both sides of the substrate. More layers can be achived in
 these processes by simply stacking multiple foil layers and adding vias (through contacts), or by folding.
 
-\subsubsection{Contact construction.}
+\begin{figure}
+    \centering
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{}
+        \caption{Small obstacle mesh coupons}
+        \label{hsm_fig_3d_sandwich_obstacle}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{}
+        \caption{Via-fence meshes}
+        \label{hsm_fig_3d_sandwich_via_fence}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{}
+        \caption{PCB lid with routed cavity and embedded planar and via-fence meshes}
+        \label{hsm_fig_3d_sandwich_lid}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{}
+        \caption{Sandwich stack}
+        \label{hsm_fig_3d_sandwich_stack}
+    \end{subfigure}
+    \caption[Sandwich mesh construction styles]{Construction styles used to cover 3D volumes using sandwich-style
+        construction.}
+    \label{hsm_fig_3d_sandwich}
+\end{figure}
+
+\subsubsection{Contact and trace construction.}
+
+\begin{figure}
+    \centering
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{trace_material_carbon.jpg}
+        \caption{Screen printing process using carbon ink}
+        \label{hsm_fig_materials_carbon_ink}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{trace_material_silver.jpg}
+        \caption{Screen printing process using silver ink}
+        \label{hsm_fig_materials_silver_ink}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        % FIXME \centering\includegraphics[width=\linewidth]{trace_material_gold.jpg}
+        \caption{Laser direct structuring using electroless gold or other metals}
+        \label{hsm_fig_materials_gold_lds}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{trace_material_copper_flex.jpg}
+        \caption{Standard photolithographic copper PCB process on flexible polyimide substrate}
+        \label{hsm_fig_materials_pcb_flex}
+    \end{subfigure}
+    \quad
+    \begin{subfigure}[t]{0.3\textwidth}
+        \centering\includegraphics[width=\linewidth]{trace_material_copper_pcb.jpg}
+        \caption{Standard photolithographic copper PCB process on rigid FR-4 fiberglass substrate}
+        \label{hsm_fig_materials_pcb_rigid}
+    \end{subfigure}
+    \caption[Mesh materials]{Materials and manufacturing processes used for mesh traces and contacts.}
+    \label{hsm_fig_materials}
+\end{figure}
 
 \subsubsection{Payment Terminal Construction}