(footprint "testpoint_pad_rect" (version 20230410) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at -0.889 0 unlocked) (layer "Dwgs.User") hide (tstamp 2975fd59-8eb0-4c37-9b60-720d4cefa703)
    (effects (font (size 0.6 0.6) (thickness 0.1)) (justify right))
  )
  (fp_text value "testpoint_pad_rect" (at -1.016 0 unlocked) (layer "F.SilkS") (tstamp 2bbe6a13-a50f-4053-bbaa-fbc708b7d0c9)
    (effects (font (size 0.6 0.6) (thickness 0.1) bold) (justify right))
  )
  (fp_rect (start -0.889 -0.508) (end 0.889 0.508)
    (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 6a5dfe1c-752a-436d-a8d0-3e3a0e2a7a6f))
  (fp_text user "${REFERENCE}" (at 0 2.5 unlocked) (layer "F.Fab") (tstamp cccc821e-6fbf-4cfa-a300-39e372b643c0)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (pad "1" smd rect (at 0 0) (size 1.5 0.8) (layers "F.Cu" "F.Mask")
    (thermal_bridge_angle 45) (tstamp b5ce34cb-7217-4ffd-9efc-91ea442946a0))
)
